Material Selection for Mold Copper Plates

The selection of material for mold copper plates primarily considers thermal conductivity, strength, and wear resistance. While pure copper offers excellent thermal conductivity, it possesses low high-temperature strength, making it susceptible to deformation and wear. To extend service life, copper alloys-such as chromium-zirconium copper or silver-bearing copper-are typically employed. These alloys maintain high thermal conductivity while exhibiting increased recrystallization temperatures and superior high-temperature strength. For instance, chromium-zirconium copper undergoes solid-solution strengthening and aging treatment, allowing the plates to retain high hardness and creep resistance even at elevated temperatures. Silver-bearing copper, through the addition of silver, gains enhanced resistance to softening and improved wear resistance. The choice of material must be optimized based on specific casting conditions, the grade of steel being cast, and particular process requirements.